Packing : 25 pc clear clean-room tape sealed Empak cassette
Wafers p/ cassette: 25 (no partials)
Bags: Heat sealed plastic inner/ foil outer
Labels: No Labels of any kind on cassette and inner bag
Box: Double walled cardboard
Packaging Material: Material that protects wafers on all sides
Packed in cassette,and sealed in vacuum bag,25pcs/cassette
According to your specification,especially resistivity and thickness
We use the Czochralski (CZ) method to grow both p-type and n-type dislocation-free silicon ingots with <100>, <111> or <110> orientation. The diameters of the ingots are 100mm, 125mm, 150mm, and 200mm. The dopant types used, and the matching resistivity ranges for each dopant are listed in the product tables.
Slicing follows the process of cutting the ingot into thin wafer slices. Wafer Works used cutting-edge wire and I.D. saws that are operated by experienced and well-trained operators to produce high quality wafers. The techniques to achieve thin wafers with low kerf loss are applied, which help to ensure wafer flatness and total thickness variation (TTV) is controlled to minimum.
After slicing process, Wafer Works used edge grinding technology to create rounded edges on each wafer. The purpose of this step is to minimize edge chipping, breakage and thermal induced slip in the subsequent customer's thermal processes. Based on different Epi thickness and/or processes, an optimized edge profile and length can be made with specific customer specifications.
Lapping Etching Backside Treatment Polishing
Polishing techniques have a big impact on the outcome of the wafer's surface, which is why Wafer Works uses sophisticated polished and a rigorous inspection process to produce world-class silicon wafers. Wafer Works is able to perform tight roughness wafer surface.
Q: How about the shipping?
A: We will send the goods by International Express like SF, Fedex, UPS or according your requirement. Usually it takes 3 -5work days to arrive.